Invention Application
- Patent Title: CHIP-ON-FILM PACKAGE HAVING BENDING PART
- Patent Title (中): 带薄膜的薄膜包装部分
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Application No.: US14714234Application Date: 2015-05-15
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Publication No.: US20160049356A1Publication Date: 2016-02-18
- Inventor: Jae-Min JUNG , Jeong-Kyu HA
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0105205 20140813
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/065

Abstract:
A chip-on-film package comprises a film substrate comprising upper and lower surfaces, and a side having a bending part. A first output interconnection formed on the upper surface of the film substrate extends from a semiconductor chip disposed on the upper surface toward the bending part. A second output interconnection includes an upper output interconnection formed on the upper surface of the film substrate, and a lower output interconnection formed on the lower surface and extending onto the bending part. An input interconnection includes an upper input interconnection formed on the upper surface of the film substrate and a lower input interconnection formed on the lower surface and extending away from the bending part. Through-vias are formed to pass through the film substrate and electrically connect the upper output interconnection to the lower output interconnection, and the upper input interconnection to the lower input interconnection.
Public/Granted literature
- US09349683B2 Chip-on-film package having bending part Public/Granted day:2016-05-24
Information query
IPC分类: