The subject technology can be embodied in a retaining structure which is configured to engage with external structures to hold an earpiece in position. The retaining structure includes a first portion forming a loop and having an upper end and a lower end. The upper end of the first portion is coupled to a top surface of a body of the earpiece and the lower end of the first portion is coupled to a bottom surface of the earpiece. The retaining structure also includes a second portion having an upper end and a lower end, wherein the lower end of the second portion is coupled to the loop formed by the first portion, and the upper end of the second portion extends from the earpiece. The top and bottom surfaces are located on substantially opposite sides of the body in a direction along a plane of the retaining structure.