Invention Application
- Patent Title: HEADSET
- Patent Title (中): 耳机
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Application No.: US14553551Application Date: 2014-11-25
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Publication No.: US20160073200A1Publication Date: 2016-03-10
- Inventor: Hyunsun YOO , Myunghyun PARK , Jaeyoung KIM , Hyungwoo PARK , Sangwoo SEO , Kunwoo LEE , Secheol OH
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Priority: KR10-2014-0117390 20140904
- Main IPC: H04R5/033
- IPC: H04R5/033 ; H04R1/10
Abstract:
A headset is provided. The headset includes: a hook hung on a user's neck; a pair of sound output units connected to both end parts of the hook; and a clipping module provided to at least one sound output unit and coupled to a cap worn by the user to allow the at least one sound output unit to be detachable.
Public/Granted literature
- US09344801B2 Headset Public/Granted day:2016-05-17
Information query
