A micromechanical device having a main plane of extension includes a sensor wafer, an evaluation wafer, and an intermediate wafer situated between the sensor wafer and the evaluation wafer, the evaluation wafer having at least one application-specific integrated circuit. The sensor wafer and/or the intermediate wafer includes a first sensor element and a second sensor element spatially separated from the first sensor element, the first and second sensor elements being respectively located in a first cavity and a second cavity each formed by the intermediate wafer and the sensor wafer, a first gas pressure in the first cavity differing from a second gas pressure in the second cavity, and the intermediate wafer having an opening at a point in a direction perpendicular to the main plane of extension.