Invention Application
- Patent Title: LIGHT EMITTING DIODE PACKAGE AND LIGHT SOURCE MODULE AND BACKLIGHT UNIT USING THE SAME
- Patent Title (中): 使用其的发光二极管封装和光源模块和背光单元
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Application No.: US14581474Application Date: 2014-12-23
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Publication No.: US20160087175A1Publication Date: 2016-03-24
- Inventor: Dong Hun Lee
- Applicant: LG Display Co., Ltd.
- Priority: KR10-2014-0127149 20140923
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H05K1/18 ; F21V8/00 ; F21V23/00

Abstract:
Disclosed is a light emitting diode (LED) package, which can be used for, for example, a light source module, a backlight unit and a display device, that may, for example, include an LED chip in a body portion of the LED package; first and second lead frames separated from each other in the body portion, each of the first and second lead frames including first and second leads that are electrically connected to the LED chip and are used as one of anode and cathode leads; and first and second dummy lead frames separated from each other in the body portion and electrically insulated from the first and second lead frames.
Public/Granted literature
- US09461221B2 Light emitting diode package and light source module and backlight unit using the same Public/Granted day:2016-10-04
Information query
IPC分类: