Invention Application
- Patent Title: Collagen Sponge
- Patent Title (中): 胶原海绵
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Application No.: US14767601Application Date: 2014-02-14
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Publication No.: US20160089474A1Publication Date: 2016-03-31
- Inventor: Ken NAKATA , Yukihiro SATO , Daisuke IKEDA , Ichiro FUJIMOTO
- Applicant: OSAKA UNIVERSITY , KOKEN CO., LTD.
- Priority: JP2013-027905 20130215
- International Application: PCT/JP2014/053462 WO 20140214
- Main IPC: A61L27/24
- IPC: A61L27/24 ; A61L27/56

Abstract:
Provided is a collagen sponge which has compressive strength (stress) equivalent to that of a tissue into which the collagen sponge is to be implanted, has no unevenness in structure and stress, and has a pore structure for allowing cells to infiltrate thereinto. The collagen sponge is obtained by subjecting a collagen dispersion, a collagen solution, or a mixture thereof having a collagen concentration of 50 mg/ml or more to freeze-drying and insolubilization treatment thereafter. The collagen sponge thus obtained has a stress of from 10 kPa to 30 kPa when loaded with 10% strain, has in its surface and inside a pore structure having a mean pore diameter ranging from 50 μm to 400 μm, and has a pore diameter standard deviation equal to or less than 80% of the mean pore diameter.
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