Invention Application
US20160095249A1 PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE HAVING THE SAME
审中-公开
印刷电路板和具有该印刷电路板的电子元件包装
- Patent Title: PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE HAVING THE SAME
- Patent Title (中): 印刷电路板和具有该印刷电路板的电子元件包装
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Application No.: US14672770Application Date: 2015-03-30
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Publication No.: US20160095249A1Publication Date: 2016-03-31
- Inventor: Hyoung KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2014-0129313 20140926
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02
Abstract:
Disclosed are a printed circuit board and an electronic component package having the printed circuit board, which includes: a base board; a heat-dissipating pad formed on the based board and having an electronic component installed thereon; and a bridging pad formed on the base board between the heat-dissipating pad and a shield can installed on the base board so as to allow heat generated by the electronic component to be transferred from the heat-dissipating pad to the shield can.
Information query
