Invention Application
- Patent Title: HEAT DISSIPATION MODULE
- Patent Title (中): 散热模块
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Application No.: US14670434Application Date: 2015-03-27
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Publication No.: US20160095256A1Publication Date: 2016-03-31
- Inventor: Ching-Sheng Chen
- Applicant: Subtron Technology Co., Ltd.
- Priority: TW103133943 20140930
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02

Abstract:
A heat dissipation module includes a hollow housing, a plurality of heat dissipation fins and heat dissipation liquid. The hollow housing includes a chamber, a side surface, a top surface and a bottom surface opposite to the top surface. The side surface is connected to the top surface and the bottom surface. The heat dissipation fins are disposed on the side surface. The heat dissipation liquid is contained within the chamber, and a specific heat of the heat dissipation liquid is substantially greater than or equal to 1 cal/g° C.
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