Invention Application
- Patent Title: Methods of Fabricating Tape Film Packages
- Patent Title (中): 制造胶带薄膜包装的方法
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Application No.: US14967490Application Date: 2015-12-14
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Publication No.: US20160111299A1Publication Date: 2016-04-21
- Inventor: Jeong-Kyu HA , Youngshin KWON , KwanJai LEE , Jae-Min JUNG , KyongSoon CHO , Sang-Uk HAN
- Applicant: Jeong-Kyu HA , Youngshin KWON , KwanJai LEE , Jae-Min JUNG , KyongSoon CHO , Sang-Uk HAN
- Priority: KR10-2012-0007303 20120125
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L21/78
Abstract:
A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.
Public/Granted literature
- US09620389B2 Methods of fabricating tape film packages Public/Granted day:2017-04-11
Information query
IPC分类:
