Invention Application
- Patent Title: EMBEDDING THIN CHIPS IN POLYMER
- Patent Title (中): 嵌入聚合物薄膜
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Application No.: US14859112Application Date: 2015-09-18
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Publication No.: US20160111353A1Publication Date: 2016-04-21
- Inventor: Conor Rafferty , Mitul Dalal
- Applicant: MC10, Inc.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31
Abstract:
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can he generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
Public/Granted literature
- US09583428B2 Embedding thin chips in polymer Public/Granted day:2017-02-28
Information query
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