Invention Application
- Patent Title: FIN-SHAPED STRUCTURE AND METHOD THEREOF
- Patent Title (中): 精细形状的结构及其方法
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Application No.: US14519146Application Date: 2014-10-21
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Publication No.: US20160111448A1Publication Date: 2016-04-21
- Inventor: Chih-Kai Hsu , Yu-Hsiang Hung , Ssu-I Fu , Jyh-Shyang Jenq
- Applicant: UNITED MICROELECTRONICS CORP.
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/66 ; H01L21/84 ; H01L21/762 ; H01L21/02 ; H01L29/78 ; H01L29/06

Abstract:
A method of forming a fin-shaped structure includes the following steps. A substrate having at least a fin structure thereon is provided. A liner is formed on sidewalls of the fin structure. An oxide layer is formed between the fin structure and the substrate. The fin structure is removed until a bottom layer of the fin structure is reserved, to form a recess between the liner. A buffer epitaxial layer and an epitaxial layer are sequentially formed in the recess. A top part of the liner is removed until sidewalls of the epitaxial layer are exposed. Moreover, a fin-shaped structure formed by said method is also provided.
Public/Granted literature
- US09524987B2 Fin-shaped structure and method thereof Public/Granted day:2016-12-20
Information query
IPC分类: