Invention Application
- Patent Title: ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
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Application No.: US14976698Application Date: 2015-12-21
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Publication No.: US20160113087A1Publication Date: 2016-04-21
- Inventor: Michael A. TISCHLER , Philippe M. SCHICK , Ian ASHDOWN , Calvin Wade SHEEN , Paul JUNGWIRTH
- Applicant: Michael A. TISCHLER , Philippe M. SCHICK , Ian ASHDOWN , Calvin Wade SHEEN , Paul JUNGWIRTH
- Main IPC: H05B33/08
- IPC: H05B33/08 ; F21K99/00 ; H05B37/02
Abstract:
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Public/Granted literature
- US09426860B2 Electronic devices with yielding substrates Public/Granted day:2016-08-23
Information query
