Invention Application
- Patent Title: WIRING SUBSTRATE
- Patent Title (中): 接线基板
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Application No.: US14992429Application Date: 2016-01-11
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Publication No.: US20160124550A1Publication Date: 2016-05-05
- Inventor: Nobuyuki Tada , Yasushi Endo , Akihiro Hashimoto , Tadashi Kuriki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2013-146601 20130712
- Main IPC: G06F3/044
- IPC: G06F3/044 ; H05K1/09 ; H05K1/11 ; H05K1/02 ; H05K1/03

Abstract:
A wiring board includes a plurality of first terminal parts for electrically connecting with a control circuit and disposed corresponding to a plurality of first electrode parts, and first terminal wiring parts for electrically connecting the plurality of first electrode parts and the corresponding first terminal parts. Each of the first terminal wiring parts has, in at least a portion thereof falling in a circle with a radius of 10 mm centering around a boundary part between the first terminal wiring parts and the corresponding first terminal parts, a portion having a line width of 5 μm to 100 μm inclusive, the wiring resistance value of the first terminal wiring parts connected to the first terminal parts being 100 ohms to 10 kohms inclusive.
Public/Granted literature
- US09727196B2 Wiring substrate Public/Granted day:2017-08-08
Information query