Invention Application
- Patent Title: Wire Harness Assembly System
- Patent Title (中): 线束装配系统
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Application No.: US14884358Application Date: 2015-10-15
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Publication No.: US20160125978A1Publication Date: 2016-05-05
- Inventor: Rodney G. Rouleau , Janina B. Nebes , Robert W. Kossak
- Applicant: PANDUIT CORP.
- Applicant Address: US IL Tinley Park
- Assignee: PANDUIT CORP.
- Current Assignee: PANDUIT CORP.
- Current Assignee Address: US IL Tinley Park
- Main IPC: H01B13/012
- IPC: H01B13/012

Abstract:
A wire harness assembly system is disclosed. The wire harness assembly system includes a locking mount for receiving a wire routing accessory. The locking mount includes a main body with an upper portion, a base flange, and a lower portion. The lower portion includes a locating shaft extending from the base flange. The locating shaft has keyed members positioned opposite each other. The locating shaft and the keyed members of the locking mount are positioned in keyed holes in a grid tile. The locking mount is rotated to a locked position in the grid tile to secure the locking mount and the wire routing accessory mounted thereto.
Information query