Invention Application
- Patent Title: METHOD FOR MANUFACTURING A PROTECTIVE LAYER AGAINST HF ETCHING, SEMICONDUCTOR DEVICE PROVIDED WITH THE PROTECTIVE LAYER AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
- Patent Title (中): 用于制造抗蚀层的保护层的方法,用保护层提供的半导体器件及制造半导体器件的方法
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Application No.: US14982380Application Date: 2015-12-29
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Publication No.: US20160130140A1Publication Date: 2016-05-12
- Inventor: Stefano LOSA , Raffaella PEZZUTO , Roberto CAMPEDELLI , Matteo PERLETTI , Luigi ESPOSITO , Mikel Azpeitia URQUIA
- Applicant: STMICROELECTRONICS S.R.L.
- Priority: ITTO2011A000989 20111028; ITTO2012A000834 20120926
- Main IPC: B81C1/00
- IPC: B81C1/00

Abstract:
A method for manufacturing a protective layer for protecting an intermediate structural layer against etching with hydrofluoric acid, the intermediate structural layer being made of a material that can be etched or damaged by hydrofluoric acid, the method comprising the steps of: forming a first layer of aluminium oxide, by atomic layer deposition, on the intermediate structural layer; performing a thermal crystallization process on the first layer of aluminium oxide, forming a first intermediate protective layer; forming a second layer of aluminium oxide, by atomic layer deposition, above the first intermediate protective layer; and performing a thermal crystallization process on the second layer of aluminium oxide, forming a second intermediate protective layer and thereby completing the formation of the protective layer. The method for forming the protective layer can be used, for example, during the manufacturing steps of an inertial sensor such as a gyroscope or an accelerometer.
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