Invention Application
- Patent Title: Meandering Interconnect on a Deformable Substrate
- Patent Title (中): 在可变形基板上的曲折互连
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Application No.: US14890175Application Date: 2013-05-10
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Publication No.: US20160132150A1Publication Date: 2016-05-12
- Inventor: Darryl COTTON , Mark ALLEN , Piers ANDREW
- Applicant: Nokia Technologies Oy
- International Application: PCT/FI2013/050513 WO 20130510
- Main IPC: G06F3/044
- IPC: G06F3/044
Abstract:
An apparatus including a first plurality of first conductive lines; and a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect includes a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines.
Public/Granted literature
- US09904425B2 Meandering interconnect on a deformable substrate Public/Granted day:2018-02-27
Information query
