Invention Application
- Patent Title: COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Patent Title (中): 复合电子元件及其相应的板
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Application No.: US14869935Application Date: 2015-09-29
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Publication No.: US20160133386A1Publication Date: 2016-05-12
- Inventor: Sang Soo PARK , Kyoung Jin JUN , Young Ghyu AHN , Heung Kil PARK
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0155179 20141110
- Main IPC: H01G4/40
- IPC: H01G4/40 ; H05K1/18 ; H01G4/30

Abstract:
A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.
Public/Granted literature
- US10229790B2 Composite electronic component and board having the same Public/Granted day:2019-03-12
Information query