Invention Application
- Patent Title: SEMICONDUCTOR WAFER PROTECTIVE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体防护膜及制造半导体器件的方法
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Application No.: US14894879Application Date: 2014-05-22
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Publication No.: US20160133500A1Publication Date: 2016-05-12
- Inventor: Akimitsu MORIMOTO , Makoto KATAOKA , Hideki FUKUMOTO
- Applicant: MITSUI CHEMICALS TOHCELLO, INC.
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: MITSUI CHEMICALS TOHCELLO, INC.
- Current Assignee: MITSUI CHEMICALS TOHCELLO, INC.
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Priority: JP2013-113448 20130529
- International Application: PCT/JP2014/063577 WO 20140522
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78 ; H01L21/02 ; B32B27/30 ; B32B27/08
Abstract:
According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A), in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9.
Public/Granted literature
- US09966297B2 Semiconductor wafer protective film and method of manufacturing semiconductor device Public/Granted day:2018-05-08
Information query
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