Invention Application
- Patent Title: MOUNTING STRUCTURE AND BGA BALL
- Patent Title (中): 安装结构和BGA球
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Application No.: US14880942Application Date: 2015-10-12
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Publication No.: US20160163668A1Publication Date: 2016-06-09
- Inventor: KIYOHIRO HINE , AKIO FURUSAWA , MASATO MORI , TAICHI NAKAMURA , HIDETOSHI KITAURA
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Priority: JP2014-244619 20141203
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C22C13/00 ; B23K35/02 ; B23K35/26 ; H01B1/02 ; H01B5/02
Abstract:
A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
Public/Granted literature
- US10068869B2 Mounting structure and BGA ball Public/Granted day:2018-09-04
Information query
IPC分类:
