Invention Application
- Patent Title: WIRING BOARD ASSEMBLY AND METHOD FOR PRODUCING SAME
- Patent Title (中): 接线板组件及其制造方法
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Application No.: US14914987Application Date: 2014-09-30
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Publication No.: US20160205765A1Publication Date: 2016-07-14
- Inventor: Ryotaro TAKAGI , Kosuke SHIMOZURU , Yuji INATANI
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2013-206501 20131001; JP2014-058224 20140320
- International Application: PCT/JP2014/076052 WO 20140930
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
A wiring board assembly (1) includes: a flexible printed wiring board (2) which includes at least an insulating substrate (5) including a through-hole (53), and wiring patterns (61) and (62) provided on the insulating substrate (5) and extending to peripheral edge portions (531n) and (532n) of the through-hole (53); a metal reinforcing plate (3) attached to the flexible printed wiring board (2) and facing the through-hole (53); and a solder connection portion (4) covering an inner wall surface (534) of the through-hole (53) and electrically connecting the wiring patterns (61) and (62) to the metal reinforcing plate (3).
Public/Granted literature
- US10237971B2 Wiring board assembly and method for producing same Public/Granted day:2019-03-19
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