Invention Application
US20160205765A1 WIRING BOARD ASSEMBLY AND METHOD FOR PRODUCING SAME 审中-公开
接线板组件及其制造方法

  • Patent Title: WIRING BOARD ASSEMBLY AND METHOD FOR PRODUCING SAME
  • Patent Title (中): 接线板组件及其制造方法
  • Application No.: US14914987
    Application Date: 2014-09-30
  • Publication No.: US20160205765A1
    Publication Date: 2016-07-14
  • Inventor: Ryotaro TAKAGIKosuke SHIMOZURUYuji INATANI
  • Applicant: FUJIKURA LTD.
  • Applicant Address: JP Tokyo
  • Assignee: FUJIKURA LTD.
  • Current Assignee: FUJIKURA LTD.
  • Current Assignee Address: JP Tokyo
  • Priority: JP2013-206501 20131001; JP2014-058224 20140320
  • International Application: PCT/JP2014/076052 WO 20140930
  • Main IPC: H05K1/02
  • IPC: H05K1/02 H05K1/11
WIRING BOARD ASSEMBLY AND METHOD FOR PRODUCING SAME
Abstract:
A wiring board assembly (1) includes: a flexible printed wiring board (2) which includes at least an insulating substrate (5) including a through-hole (53), and wiring patterns (61) and (62) provided on the insulating substrate (5) and extending to peripheral edge portions (531n) and (532n) of the through-hole (53); a metal reinforcing plate (3) attached to the flexible printed wiring board (2) and facing the through-hole (53); and a solder connection portion (4) covering an inner wall surface (534) of the through-hole (53) and electrically connecting the wiring patterns (61) and (62) to the metal reinforcing plate (3).
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