Invention Application
- Patent Title: Capacitive Sensors for Electronic Devices and Methods of Forming the Same
- Patent Title (中): 电子设备的电容式传感器及其形成方法
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Application No.: US14641150Application Date: 2015-03-06
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Publication No.: US20160258981A1Publication Date: 2016-09-08
- Inventor: Tyler S. Bushnell , Vikram Garg
- Applicant: Apple Inc.
- Main IPC: G01R1/04
- IPC: G01R1/04 ; H05K3/10 ; G06F3/044
Abstract:
Capacitive sensor assemblies for electronic devices, and methods of forming capacitive sensor assemblies. The capacitive sensor assembly may include a top component having an intermediate layer formed on the top component, a bottom component positioned opposite the top component, a silicone layer positioned between the top component and the bottom component, and a first electrical trace positioned adjacent the silicone layer.
Public/Granted literature
- US10006937B2 Capacitive sensors for electronic devices and methods of forming the same Public/Granted day:2018-06-26
Information query
