Invention Application
- Patent Title: SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US15065850Application Date: 2016-03-09
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Publication No.: US20160268216A1Publication Date: 2016-09-15
- Inventor: Young-Ja KIM , Bongchan KIM
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2015-0033255 20150310
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L21/3205 ; H01L21/56 ; H01L21/78
Abstract:
Provided is a method of fabricating a semiconductor package. The method includes providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chips; forming a first shielding layer on the mold layer; cutting the mold layer and the first shielding layer to form trenches between the semiconductor chips; and forming a second shielding layer to fill the trenches.
Public/Granted literature
- US09818699B2 Semiconductor packages and methods of fabricating the same Public/Granted day:2017-11-14
Information query
IPC分类:
