Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
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Application No.: US15184511Application Date: 2016-06-16
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Publication No.: US20160295684A1Publication Date: 2016-10-06
- Inventor: Yong Seok Cho , Chang Sung Kim
- Applicant: LG INNOTEK CO., LTD.
- Priority: KR10-2011-0141772 20111223
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.
Public/Granted literature
- US09814129B2 Printed circuit board and method of fabricating the same Public/Granted day:2017-11-07
Information query
