Invention Application
- Patent Title: INTEGRATION OF HEAT SPREADER FOR BEOL THERMAL MANAGEMENT
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Application No.: US15183896Application Date: 2016-06-16
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Publication No.: US20160300775A1Publication Date: 2016-10-13
- Inventor: Archana Venugopal , Marie Denison , Luigi Colombo , Sameer Pendharkar
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/48 ; H01L23/373
Abstract:
A microelectronic device includes a heat spreader layer on an electrode of a component and a metal interconnect on the heat spreader layer. The heat spreader layer is disposed above a top surface of a substrate of the semiconductor device. The heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
Public/Granted literature
- US10468324B2 Integration of heat spreader for beol thermal management Public/Granted day:2019-11-05
Information query
IPC分类:
