Invention Application
- Patent Title: WIRE BONDING SYSTEMS AND RELATED METHODS
- Patent Title (中): 电线连接系统及相关方法
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Application No.: US15091436Application Date: 2016-04-05
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Publication No.: US20160307865A1Publication Date: 2016-10-20
- Inventor: Wentao QIN , Gordon M. GRIVNA , Harold ANDERSON , Thomas ANDERSON , George CHANG
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.
Public/Granted literature
- US10109610B2 Wire bonding systems and related methods Public/Granted day:2018-10-23
Information query
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