Invention Application
- Patent Title: In-Vehicle Electronic Module
- Patent Title (中): 车载电子模块
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Application No.: US15100852Application Date: 2014-11-17
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Publication No.: US20160309600A1Publication Date: 2016-10-20
- Inventor: Ryouichi KAJIWARA , Masaru KAMOSHIDA , Toshiaki ISHII
- Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Priority: JP2013-270798 20131227
- International Application: PCT/JP2014/080290 WO 20141117
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K3/28 ; B23K1/00 ; B23K35/26 ; B23K1/08 ; H05K1/11 ; H05K3/34

Abstract:
There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.
Public/Granted literature
- US09743539B2 In-vehicle electronic module Public/Granted day:2017-08-22
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