Invention Application
- Patent Title: MICROSTRUCTURE PLATING SYSTEMS AND METHODS
- Patent Title (中): 微结构镀层系统及方法
-
Application No.: US15162027Application Date: 2016-05-23
-
Publication No.: US20170001856A1Publication Date: 2017-01-05
- Inventor: Gordon A. Shaw , Daniel Baseman , Chris Finn , Jim G. Hunter
- Applicant: Honeywell International Inc.
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00
Abstract:
Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
Public/Granted literature
- US09758364B2 Microstructure plating systems Public/Granted day:2017-09-12
Information query
