Invention Application
- Patent Title: LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS
- Patent Title (中): LEADFRAME包装与稳定的扩展领先
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Application No.: US14788303Application Date: 2015-06-30
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Publication No.: US20170005028A1Publication Date: 2017-01-05
- Inventor: Jefferson Talledo
- Applicant: STMicroelectronics, Inc.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L21/56

Abstract:
Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral to the leadframe allows the support to be built to the proper height to support the cantilevered lead in each package and reduces or eliminates the upward, downward, and side to side deflections caused or allowed by supports built-in to the tooling of the manufacturing equipment. Also, by building the support into the leadframe, the leadframes may be pretaped prior to the die attach and wire bonding steps of the manufacturing process.
Public/Granted literature
- US09847281B2 Leadframe package with stable extended leads Public/Granted day:2017-12-19
Information query
IPC分类: