Invention Application
- Patent Title: ADHESIVE COMPOSITION, ADHESIVE SHEET, AND ELECTRONIC DEVICE
- Patent Title (中): 胶粘组合物,粘合片和电子装置
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Application No.: US15121135Application Date: 2015-02-23
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Publication No.: US20170015870A1Publication Date: 2017-01-19
- Inventor: Kenta NISHIJIMA , Yuichi MORI , Yoshiaki HAGIHARA
- Applicant: LINTEC Corporation
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2014-034158 20140225
- International Application: PCT/JP2015/055042 WO 20150223
- Main IPC: C09J4/06
- IPC: C09J4/06 ; H01L51/52 ; H01L51/00 ; B32B7/12 ; C09J7/02

Abstract:
The present invention is an adhesive composition including a Polyisobutylene-based resin (A), an energy ray-curable resin (B), and a tackifier (C), the energy ray-curable resin (B) including a difunctional acrylate that includes a divalent alicyclic hydrocarbon group, the adhesive composition including the energy ray-curable resin (B) in a ratio of 5 to 59 parts by mass based on 100 parts by mass of the Polyisobutylene-based resin (A), and including the tackifier (C) in a ratio of 0.1 to 40 parts by mass based on 100 parts by mass of the Polyisobutylene-based resin (A); and an adhesive sheet including a release sheet, and an adhesive layer that is formed on the release sheet, the adhesive layer being formed using the adhesive composition; and an electronic device including a transparent substrate, a device, and a sealing material, the sealing material being formed using the adhesive composition.
Information query
IPC分类: