Invention Application
- Patent Title: HORIZONTAL GATE ALL AROUND DEVICE ISOLATION
- Patent Title (中): 水平门围绕设备隔离
-
Application No.: US15279257Application Date: 2016-09-28
-
Publication No.: US20170018624A1Publication Date: 2017-01-19
- Inventor: Shiyu SUN , Naomi YOSHIDA , Theresa Kramer GUARINI , Sung Won JUN , Benjamin COLOMBEAU , Michael CHUDZIK
- Applicant: Applied Materials, Inc.
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/306 ; H01L21/762 ; H01L21/02

Abstract:
Embodiments described herein generally relate to methods and apparatus for horizontal gate all around (hGAA) isolation. A superlattice structure comprising different materials arranged in an alternatingly stacked formation may be formed on a substrate. The different materials may be silicon containing materials and one or more III/V materials. In one embodiment, at least one of the layers of the superlattice structure may be oxidized to form a buried oxide layer adjacent the substrate.
Public/Granted literature
- US10573719B2 Horizontal gate all around device isolation Public/Granted day:2020-02-25
Information query
IPC分类: