Invention Application
- Patent Title: Fan-out POP Structure with Inconsecutive Polymer Layer
- Patent Title (中): 具有不连续聚合物层的扇出POP结构
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Application No.: US15284003Application Date: 2016-10-03
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Publication No.: US20170025359A1Publication Date: 2017-01-26
- Inventor: Yi-Lin Tsai , Jeffrey Chang , Jing-Cheng Lin , Nai-Wei Liu , Tsei-Chung Fu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/10 ; H01L25/00 ; H01L21/56 ; H01L21/78 ; H01L23/31 ; H01L21/48
Abstract:
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.
Public/Granted literature
- US10083913B2 Fan-out POP structure with inconsecutive polymer layer Public/Granted day:2018-09-25
Information query
IPC分类:
