Invention Application
- Patent Title: Methods for Integrating a Compliant Material with a Substrate
- Patent Title (中): 将合格材料与基材整合的方法
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Application No.: US14838959Application Date: 2015-08-28
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Publication No.: US20170060290A1Publication Date: 2017-03-02
- Inventor: Po-Jui Chen , Kuo-Hua Sung , Hui Chen
- Applicant: Apple Inc.
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041 ; H05K3/36
Abstract:
A sensor module can include a sensor that is configured to detect any given input or environmental conditions, such as, for example, touch or force inputs. The sensor module can be included in an electronic device. Methods for producing the sensor module are disclosed.
Public/Granted literature
- US10101857B2 Methods for integrating a compliant material with a substrate Public/Granted day:2018-10-16
Information query
