Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US15078452Application Date: 2016-03-23
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Publication No.: US20170079142A1Publication Date: 2017-03-16
- Inventor: Jae-Ean LEE , Jung-Han LEE , Jin-Ho PARK , Jung-Hyun CHO , Yong-Ho BAEK
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2015-0131215 20150916
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/00 ; H05K1/09 ; H05K3/46 ; H05K1/02 ; H05K1/11
Abstract:
A printed circuit board and a manufacturing method thereof are provided. A printed circuit board may include a first insulating layer comprising a photosensitive material on a core layer, a second insulating layer comprising a material comprising a reinforcing material on the first insulating layer, and a cavity formed in the first insulating layer and the second insulating layer.
Information query
