Invention Application
- Patent Title: BASE FILM FOR DICING SHEETS AND DICING SHEET
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Application No.: US15318383Application Date: 2014-06-18
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Publication No.: US20170121569A1Publication Date: 2017-05-04
- Inventor: Naoki TAYA , Yuki NITO , Yusuke MIYATAKE
- Applicant: LINTEC CORPORATION
- International Application: PCT/JP2014/066140 WO 20140618
- Main IPC: C09J7/02
- IPC: C09J7/02 ; B32B7/12 ; H01L21/683 ; B32B27/06

Abstract:
A base film for dicing sheets that is used in a dicing sheet comprising the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film comprises at least a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film for dicing sheets is wound up. The second resin layer has a crystallinity of 28% to 45%, The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film for dicing sheets is 25% to 80%.
Public/Granted literature
- US10438831B2 Base film for dicing sheets and dicing sheet Public/Granted day:2019-10-08
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