Invention Application
- Patent Title: WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS
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Application No.: US15354864Application Date: 2016-11-17
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Publication No.: US20170144438A1Publication Date: 2017-05-25
- Inventor: Masumi HAYAKAWA , Takashi KATO
- Applicant: SEIKO EPSON CORPORATION
- Priority: JP2015-228460 20151124
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B81C3/00 ; B81B7/00

Abstract:
A wiring structure includes a connecting terminal array formed on a first substrate and a connected terminal array formed on a second substrate, which are electrically connected, wherein a dummy terminal that is not used for transmission and reception of an electrical signal is provided on at least one end of the connecting terminal array in a terminal arrangement direction, and an anisotropic conductive film containing a conductive particle which is disposed between the first substrate and the second substrate extends to the dummy terminal such that an end of the anisotropic conductive film is located on a surface of the dummy terminal.
Information query
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