• Patent Title: WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS
  • Application No.: US15354864
    Application Date: 2016-11-17
  • Publication No.: US20170144438A1
    Publication Date: 2017-05-25
  • Inventor: Masumi HAYAKAWATakashi KATO
  • Applicant: SEIKO EPSON CORPORATION
  • Priority: JP2015-228460 20151124
  • Main IPC: B41J2/14
  • IPC: B41J2/14 B81C3/00 B81B7/00
WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS
Abstract:
A wiring structure includes a connecting terminal array formed on a first substrate and a connected terminal array formed on a second substrate, which are electrically connected, wherein a dummy terminal that is not used for transmission and reception of an electrical signal is provided on at least one end of the connecting terminal array in a terminal arrangement direction, and an anisotropic conductive film containing a conductive particle which is disposed between the first substrate and the second substrate extends to the dummy terminal such that an end of the anisotropic conductive film is located on a surface of the dummy terminal.
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