Invention Application
- Patent Title: HOUSING COMPONENTS FOR ELECTRONIC DEVICES
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Application No.: US15402465Application Date: 2017-01-10
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Publication No.: US20170147041A1Publication Date: 2017-05-25
- Inventor: Todd F. Gotham , Andrew David Lauder , Tang Yew Tan , Erik L. Wang , Phillip Michael Hobson , Richard Hung Minh Dinh , Christopher Stringer , Richard Howarth , John Ternus , Rico Zorkendorfer
- Applicant: Apple Inc.
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H04R3/00 ; G06F1/16

Abstract:
Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.
Public/Granted literature
- US10248169B2 Housing components for electronic devices Public/Granted day:2019-04-02
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