Invention Application
- Patent Title: CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES
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Application No.: US14947437Application Date: 2015-11-20
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Publication No.: US20170150595A1Publication Date: 2017-05-25
- Inventor: Tran Lin
- Applicant: Hamilton Sundstrand Corporation
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/367 ; H01L23/50 ; H05K3/22 ; H05K1/18 ; H05K1/11 ; G01R31/02 ; G01R31/04 ; H01L23/15 ; H01L23/498

Abstract:
A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.
Public/Granted literature
- US09883582B2 Circuit boards and circuit board assemblies Public/Granted day:2018-01-30
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