Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Application No.: US15045258Application Date: 2016-02-17
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Publication No.: US20170200721A1Publication Date: 2017-07-13
- Inventor: Chien-Hung Chen , Shih-Hsien Huang , Yu-Ru Yang , Chia-Hsun Tseng , Cheng-Tzung Tsai , Chun-Yuan Wu
- Applicant: UNITED MICROELECTRONICS CORP.
- Priority: CN201610018287.X 20160112
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/02 ; H01L21/306 ; H01L29/165 ; H01L21/8238

Abstract:
A semiconductor device includes a substrate, a first well formed in the substrate, a second well formed in the substrate, a first fin formed on the first well, and a second fin formed on the second well. The first well includes a first conductivity type, the second well includes a second conductivity type, and the first conductivity type and the second conductivity type are complementary to each other. The substrate includes a first semiconductor material. The first fin and the second fin include the first semiconductor material and a second semiconductor material. A lattice constant of the second semiconductor material is larger than a lattice constant of the first semiconductor material. The first semiconductor material in the first fin includes a first concentration, the first semiconductor material in the second fin includes a second concentration, and the second concentration is larger than the first concentration.
Public/Granted literature
- US10573649B2 Semiconductor device and manufacturing method thereof Public/Granted day:2020-02-25
Information query
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