Invention Application
- Patent Title: Polymerization Method for Preparing Conductive Polymer
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Application No.: US15623728Application Date: 2017-06-15
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Publication No.: US20170283604A1Publication Date: 2017-10-05
- Inventor: ANTONY P. CHACKO , YARU SHI , JOHN OLS
- Applicant: KEMET ELECTRONICS CORPORATION
- Assignee: KEMET ELECTRONICS CORPORATION
- Current Assignee: KEMET ELECTRONICS CORPORATION
- Main IPC: H01G4/08
- IPC: H01G4/08 ; C08G75/06 ; C08L65/00 ; H01B1/12 ; H01G4/005 ; H01G9/00 ; H01G9/025 ; H01G9/028 ; C08L25/18 ; C08L71/02

Abstract:
An improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
Public/Granted literature
- US10242799B2 Polymerization method for preparing conductive polymer Public/Granted day:2019-03-26
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