Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER
-
Application No.: US15607270Application Date: 2017-05-26
-
Publication No.: US20170287851A1Publication Date: 2017-10-05
- Inventor: Anna M. Prakash , Reynaldo Alberto Olmedo , Venmathy McMahan , Rajendra C. Dias , Joshua David Heppner , Ann Jinyan Xu , Sriya Sanyal , Eric Jin Li
- Applicant: Intel Corporation
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/56 ; H01L23/29
Abstract:
Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
Public/Granted literature
- US09991211B2 Semiconductor package having an EMI shielding layer Public/Granted day:2018-06-05
Information query
IPC分类:
