Invention Application
- Patent Title: CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION FOR HIGH EFFECTIVE POLISHING OF SUBSTRATES COMPRISING GERMANIUM
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Application No.: US15536447Application Date: 2015-12-04
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Publication No.: US20170369743A1Publication Date: 2017-12-28
- Inventor: Max SIEBERT , Michael LAUTER , Yongqing LAN , Robert REICHARDT , Alexandra MUENCH , Manuel SIX , Gerald DANIEL , Bastian Marten NOLLER , Kevin HUANG , Sheik Ansar USMAN IBRAHIM
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Priority: EP14198297.5 20141216
- International Application: PCT/IB2015/059351 WO 20151204
- Main IPC: C09G1/04
- IPC: C09G1/04 ; H01L21/304 ; C09K13/00 ; H01L21/461 ; C09G1/02
Abstract:
Disclosed herein is a chemical mechanical polishing (CMP) composition (Q) containing (A) inorganic particles, (B) a compound of general formula (I) below, and (C) an aqueous medium, in which the composition (Q) has a pH of from 2 to 6.
Public/Granted literature
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