Invention Application
- Patent Title: METHOD FOR PRODUCING WIRED CIRCUIT BOARD
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Application No.: US15628059Application Date: 2017-06-20
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Publication No.: US20180007795A1Publication Date: 2018-01-04
- Inventor: Yuu SUGIMOTO , Hiroyuki TANABE , Yoshito FUJIMURA
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2016-132047 20160701
- Main IPC: H05K3/18
- IPC: H05K3/18 ; G03F7/26 ; G03F7/20 ; H05K3/10

Abstract:
A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.
Public/Granted literature
- US10524363B2 Method for producing wired circuit board Public/Granted day:2019-12-31
Information query