Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, a tamper-detect sensor, a monitor, and a sensor connection adapter. The enclosure encloses, at least in part, one or more electronic components to be protected, and the tamper-detect sensor is disposed over an inner surface of the enclosure to facilitate defining a secure volume about the electronic component(s). The tamper-detect sensor includes sensor lines disposed over the inner surface of the enclosure, and the monitor monitors the tamper-detect sensor for a tamper event. The sensor connection adapter is coupled to the inner surface of the enclosure, and is disposed over the tamper-detect sensor within the secure volume. The sensor connection adapter facilitates electrically connecting the monitor to the sensor lines of the tamper-detect sensor.