Invention Application
- Patent Title: Wafer Chuck, Use of the Wafer Chuck and Method for Testing a Semiconductor Wafer
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Application No.: US15701126Application Date: 2017-09-11
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Publication No.: US20180082882A1Publication Date: 2018-03-22
- Inventor: Rudolf Zelsacher , Peter Irsigler , Thomas Christian Neidhart
- Applicant: Infineon Technologies AG
- Priority: DE102016117682.6 20160920
- Main IPC: H01L21/687
- IPC: H01L21/687 ; G01R31/28 ; B25B11/00
Abstract:
A wafer chuck configured to support a wafer during a wafer test procedure comprises a contact portion for supporting the wafer while being in contact with the wafer. The contact portion is made of a conductive material, the conductive material having a melting point larger than 1500° C.
Public/Granted literature
- US1816670A Capped elbow Public/Granted day:1931-07-28
Information query
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