Invention Application
- Patent Title: RESIN COMPOSITION AND RESIN MOLDED ARTICLE
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Application No.: US15789405Application Date: 2017-10-20
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Publication No.: US20180171098A1Publication Date: 2018-06-21
- Inventor: Daisuke NAKAYAMA , Tsuyoshi MIYAMOTO , Masayuki OKOSHI , Hiroyuki MORIYA
- Applicant: Fuji Xerox Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP2016-248098 20161221
- Main IPC: C08K3/04
- IPC: C08K3/04 ; C08L23/00 ; C08L77/00

Abstract:
A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the amino group present on the terminal (terminal amino group) is higher than a presence ratio of the carboxy group present the terminal (terminal carboxy group), and a compatibilizer.
Information query