Invention Application
- Patent Title: POROUS FILM AND METHOD FOR PRODUCING SAME
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Application No.: US15756759Application Date: 2016-08-31
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Publication No.: US20180250640A1Publication Date: 2018-09-06
- Inventor: Tsukasa SUGAWARA
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Priority: JP2015-174532 20150904
- International Application: PCT/JP2016/075571 WO 20160831
- Main IPC: B01D67/00
- IPC: B01D67/00 ; B01D71/34 ; B01D71/68 ; B01D71/64 ; B01D69/12 ; B01D69/02 ; C08J9/26 ; H01M2/16 ; H01M10/0525

Abstract:
Provided are a porous film having excellent surface smoothness and a method for producing the same. The surface roughness of a porous film of polyvinylidene fluoride, polyethersulfone, polyimide and/or polyamide-imide is Ra 30,000 Å or less. The opening diameter of the porous film is preferably from 100 nm to 5000 nm. The method for producing a porous film preferably includes a step for kneading a varnish containing fine particles and at least one resin selected from the group consisting of polyvinylidene fluoride, polyether sulfone, polyamic acid, polyimide, polyamide-imide precursor, and polyamide-imide. The varnish preferably has a viscosity at 25° C. of 0.1-3 Pa·s, a solids fraction concentration of 10-50 mass %, and a fine particle average particle size of 10-5000 nm.
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