Invention Application
- Patent Title: CAPACITOR SUBSTRATE UNIT FOR OPENING/CLOSING MODULE
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Application No.: US15963267Application Date: 2018-04-26
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Publication No.: US20180367055A1Publication Date: 2018-12-20
- Inventor: Yasuhiko KITAMURA , Hiroaki TAKAHASHI , Shozo KANZAKI , Toshiyuki YASUTOMI
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2017-116579 20170614
- Main IPC: H02M7/00
- IPC: H02M7/00 ; H02P27/06 ; H05K1/18 ; H05K1/11 ; H01G9/15 ; H01G11/04 ; H01G9/26 ; H01G11/10 ; H01G9/028 ; H01G9/045 ; H01G11/30 ; H01G11/78 ; H05K1/02 ; H01G11/18 ; H01G9/00 ; H02M1/14

Abstract:
To downsize a power smoothing capacitor substrate unit for opening/closing modules configured to convert a low-voltage DC power to AC power to drive a three-phase AC motor. A plurality of unit capacitors (101) being a conductive polymer aluminum electrolytic capacitor are connected between a positive-side first conductive plate (10P0) connected to a positive-side power supply terminal (125P) and a negative-side second conductive plate (10N) connected to a negative-side power supply terminal (124N), and three or more capacitor rows are arranged for each of three pairs of divided power supply terminal blocks (130B) connected to the opening/closing modules (90B) and one or more capacitor rows are arranged between the terminal blocks. Accordingly, ripple currents in a large number of capacitors connected in parallel to each other are equalized to prevent a temperature increase in each capacitor.
Public/Granted literature
- US10305389B2 Capacitor substrate unit for opening/closing module Public/Granted day:2019-05-28
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