Invention Application
- Patent Title: TETRAFLUOROETHYLENE/HEXAFLUOROPROPYLENE COPOLYMER, AND ELECTRIC WIRE
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Application No.: US16274119Application Date: 2019-02-12
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Publication No.: US20190177453A1Publication Date: 2019-06-13
- Inventor: Tadaharu Isaka , Ryouichi Fukagawa , Takeshi Shimono , Keizou Shiotsuki
- Applicant: Daikin Industries, Ltd. , Daikin America, Inc.
- Applicant Address: JP Osaka US NY Orangeburg
- Assignee: Daikin Industries, Ltd.,Daikin America, Inc.
- Current Assignee: Daikin Industries, Ltd.,Daikin America, Inc.
- Current Assignee Address: JP Osaka US NY Orangeburg
- Main IPC: C08F214/26
- IPC: C08F214/26 ; C09D127/18 ; H01B3/44

Abstract:
Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372° C. of 35.0 to 45.0 g/10 minutes and a swell of −8.0% to 5.0%, the sum of the numbers of —CF2H groups and unstable end groups being 120 or less per 1×106 carbon atoms.
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