Invention Application
- Patent Title: 3D SENSING CAMERA OF ELECTRONIC DEVICE
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Application No.: US16248996Application Date: 2019-01-16
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Publication No.: US20200169721A1Publication Date: 2020-05-28
- Inventor: SHIN-WEN CHEN , YE-QUANG CHEN , JING-WEI LI , SHENG-JIE DING , CHIA-WEI CHEN
- Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3c7d00be
- Main IPC: H04N13/257
- IPC: H04N13/257 ; H04N9/07 ; H04N5/225 ; H04N13/25

Abstract:
A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.
Public/Granted literature
- US10785467B2 3D sensing camera of electronic device Public/Granted day:2020-09-22
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