Invention Application
- Patent Title: Thermal Conducting Sheet, Method for Manufacturing Thermal Conducting Sheet, Heat Dissipation Member, and Semiconductor Device
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Application No.: US17479307Application Date: 2021-09-20
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Publication No.: US20220084902A1Publication Date: 2022-03-17
- Inventor: Hiroki Kanaya , Shinichi Uchida , Keisuke Aramaki
- Applicant: Dexerials Corporation
- Applicant Address: JP Tokyo
- Assignee: Dexerials Corporation
- Current Assignee: Dexerials Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2016-005400 20160114,JP2016-254243 20161227
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/373 ; C08K9/08 ; C08K3/28 ; H01L23/42 ; C08K3/22 ; C08L83/04 ; B32B27/28 ; B32B38/00
Abstract:
Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
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